TAC-3000 邊緣AI平臺
遠距離監管
動態監察
遠控系統運維
應急設定
遠距離監管
動態監察
遠控系統運維
應急設定
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產品描述
阿普奇外(wai)緣(yuan)AI平臺TAC-3000是一款(kuan)更(geng)適用(yong)于邊緣(yuan)計(ji)(ji)算(suan)(suan)領域(yu)的(de)(de)嵌(qian)入(ru)式(shi)(shi)工控機(ji)(ji)，具(ju)(ju)(ju)備強大(da)(da)的(de)(de)計(ji)(ji)算(suan)(suan)能(neng)(neng)力(li)(li)和(he)豐富的(de)(de)功(gong)能(neng)(neng)特點。嵌(qian)入(ru)式(shi)(shi)工控機(ji)(ji)TAC-3000采用(yong)高(gao)性能(neng)(neng)AI控制(zhi)器(qi)，算(suan)(suan)力(li)(li)高(gao)達100TOPS，可(ke)快速(su)處理復雜的(de)(de)AI算(suan)(suan)法和(he)大(da)(da)量數據，確(que)保(bao)邊緣(yuan)計(ji)(ji)算(suan)(suan)的(de)(de)效(xiao)率(lv)和(he)準(zhun)確(que)性。支持(chi)(chi)NVIDIA Jetson TMS O-DIMM連接器(qi)核心板，提(ti)供高(gao)性能(neng)(neng)AI計(ji)(ji)算(suan)(suan)單(dan)元(yuan)，滿足(zu)各(ge)種(zhong)邊緣(yuan)計(ji)(ji)算(suan)(suan)應用(yong)需求。嵌(qian)入(ru)式(shi)(shi)工控機(ji)(ji)TAC-3000還具(ju)(ju)(ju)有(you)豐富的(de)(de)擴展接口，包(bao)括3個(ge)千兆網絡接口、4個(ge)USB 3.0接口以(yi)及可(ke)選的(de)(de)16位DIO和(he)2個(ge)RS232/RS485 COM接口，適應各(ge)種(zhong)不(bu)同的(de)(de)邊緣(yuan)計(ji)(ji)算(suan)(suan)應用(yong)需求。支持(chi)(chi)5G/4G/WiFi功(gong)能(neng)(neng)擴展，具(ju)(ju)(ju)備強大(da)(da)的(de)(de)無(wu)線通信能(neng)(neng)力(li)(li)，實(shi)現(xian)高(gao)速(su)數據交互。同時用(yong)于無(wu)排風扇超省油的(de)(de)suv定(ding)制(zhi)，全五金高(gao)韌(ren)度車身，適配桌面上式(shi)(shi)和(he)DIN安裝方(fang)(fang)式(shi)(shi)，方(fang)(fang)便部署(shu)和(he)使(shi)用(yong)。提(ti)供穩(wen)定(ding)的(de)(de)DC 12~28V寬壓輸入(ru)，確(que)保(bao)在(zai)各(ge)種(zhong)工作條件下穩(wen)定(ding)運行，滿足(zu)高(gao)負載邊緣(yuan)計(ji)(ji)算(suan)(suan)場(chang)景需求。
自始至終，阿普奇置于式工業控制機TAC-3000借助龐大的的算出來力量、非常豐富的擴張界面、固定的主機電源生產、龐大的的wifi手機流量力量還有遲鈍的研究部署行為等優缺點，滿足需要當代角處算出來用需求分析。選app在多種角處算出來動畫場景，著力推進角處算出來技藝的成長 和用。|
Model |
TAC-3000 |
||||
|
Processor System |
SOM |
Nano |
TX2 NX |
Xavier NX |
Xavier NX 16GB |
|
AI Performance |
472 GFLOPS |
1.33 TFLOPS |
21 TOPS |
||
|
GPU |
128-core NVIDIA Maxwell??architecture GPU |
256-core NVIDIA Pascal??architecture GPU |
384-core NVIDIA Volta??architecture GPU with 48 Tensor Cores |
||
|
GPU Max Frequency |
921MHz |
1.3 GHz |
1100 MHz |
||
|
CPU |
Quad-core?ARM??Cortex?-A57?MPCore processor |
Dual-core?NVIDIA DenverTM?2?64-bit?CPU?and?quad-core?Arm??Cortex?-A57 MPCore processor |
6-core NVIDIA Carmel Arm? v8.2 64-bit CPU 6MB L2 + 4MB L3 |
||
|
CPU Max Frequency |
1.43GHz |
Denver 2: 2 GHz Cortex-A57: 2 GHz |
1.9 GHz |
||
|
Memory |
4GB?64-bit?LPDDR4 25.6GB/s |
4GB?128-bit?LPDDR4 51.2GB/s |
8GB?128-bit? LPDDR4x 59.7GB/s |
16GB?128-bit?LPDDR4x 59.7GB/s |
|
|
TDP |
5W-10W |
7.5W - 15W |
10W - 20W |
||
|
Processor System |
SOM |
Orin Nano 4GB |
Orin Nano 8GB |
Orin NX 8GB |
Orin NX 16GB |
|
AI Performance |
20 TOPS |
40 TOPS |
70 TOPS |
100 TOPS |
|
|
GPU |
512-core NVIDIA Ampere architecture GPU with 16 Tensor Cores |
1024-core NVIDIA Ampere architecture GPU? with 32 Tensor Cores |
1024-core NVIDIA Ampere? architecture GPU ?with 32 Tensor Cores |
||
|
GPU Max Frequency |
625 MHz |
765 MHz |
918 MHz |
? |
|
|
CPU |
6-core Arm??Cortex??A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3 |
6-core Arm?? Cortex??A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3 |
8-core Arm?? Cortex?? A78AE v8.2 64-bit CPU?2MB L2 + 4MB L3 |
||
|
CPU Max Frequency |
1.5 GHz |
2 GHz |
|||
|
Memory |
4GB 64-bit LPDDR5 34 GB/s |
8GB 128-bit LPDDR5 68 GB/s |
8GB 128-bit LPDDR5 102.4 GB/s |
16GB 128-bit LPDDR5 102.4 GB/s |
|
|
TDP |
7W - 10W |
7W - 15W |
10W - 20W |
10W - 25W |
|
|
Ethernet |
Controller |
1 * GBE LAN Chip (LAN signal from System-on-Module), 10/100/1000 Mbps2 * Intel??I210-AT, 10/100/1000 Mbps | |||
|
Storage |
eMMC |
16GB eMMC 5.1 (Orin Nano and Orin NX SOMs do not support eMMC) | |||
|
M.2 |
1 * M.2 Key-M (NVMe SSD, 2280) (Orin Nano and Orin NX SOMs is PCIe x4 signal, while other SOMs is PCIe x1 signal) | ||||
|
TF Slot |
1 * TF Card Slot (Orin Nano and Orin NX SOMs do not support TF Card) | ||||
|
Expansion Slots |
Mini PCIe |
1 * Mini PCIe Slot (PCIe x1+USB 2.0, with 1 * Nano SIM Card) (Nano SOM do not have PCIe x1 signal) | |||
|
M.2 |
1 * M.2 Key-B Slot (USB 3.0, with 1 * Nano SIM Card, 3052) | ||||
|
Front I/O |
Ethernet |
2 * RJ45 | |||
|
USB |
4 * USB3.0 (Type-A) | ||||
|
Display |
1 * HDMI: Resolution up to 4K @ 60Hz | ||||
|
Button |
1 * Power Button + Power LED 1 * System Reset Button |
||||
|
Side I/O |
USB |
1 * USB 2.0 (Micro USB, OTG) | |||
|
Button |
1 * Recovery Button | ||||
|
Antenna |
4 * Antenna hole | ||||
|
SIM |
2 * Nano SIM | ||||
|
Internal I/O |
Serial |
2 * RS232/RS485 (COM1/2, wafer, Jumper Switch)1 * RS232/TTL (COM3, wafer, Jumper Switch) | |||
|
PWRBT |
1 * Power Button (wafer) | ||||
|
PWRLED |
1 * Power LED (wafer) | ||||
|
Audio |
1 * Audio (Line-Out + MIC, wafer)1 * Amplifier, 3-W (per channel) into a 4-Ω Loads (wafer) | ||||
|
GPIO |
1 * 16 bits DIO (8xDI and 8xDO, wafer) | ||||
|
CAN Bus |
1 * CAN (wafer) | ||||
|
FAN |
1 * CPU FAN (wafer) | ||||
|
Power Supply |
Type |
DC, AT | |||
|
Power Input Voltage |
12~28V DC | ||||
|
Connector |
Terminal block, 2Pin, P=5.00/5.08 | ||||
|
RTC Battery |
CR2032 Coin Cell | ||||
|
OS Support |
Linux |
Nano/TX2 NX/Xavier NX: JetPack 4.6.3Orin Nano/Orin NX: JetPack 5.3.1 | |||
|
Mechanical |
Enclosure Material |
Radiator: Aluminum alloy, Box: SGCC | |||
|
Dimensions |
150.7mm(L) * 144.5mm(W) * 45mm(H) | ||||
|
Mounting |
Desktop、DIN-rail | ||||
|
Environment |
Heat Dissipation System |
Fan less design | |||
|
Operating Temperature |
-20~60℃?with 0.7 m/s airflow | ||||
|
Storage Temperature |
-40~80℃ | ||||
|
Relative Humidity |
10 to 95% (non-condensing) | ||||
|
Vibration |
3Grms@5~500Hz, random, 1hr/axis (IEC 60068-2-64) | ||||
|
Shock |
10G, half sine, 11ms (IEC 60068-2-27) | ||||
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TAC-3000 邊緣AI平臺
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