E7S系列H610平臺 嵌入式工控機/BOX
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產品描述
阿普奇嵌(qian)到式(shi)工(gong)業(ye)自動(dong)化機(ji)E7S系列(lie)表Q670軟件(jian)手機(ji)平臺(tai)一款實(shi)(shi)用功(gong)(gong)能(neng)(neng)堅強的(de)放(fang)到式(shi)制(zhi)造(zao)業(ye)智能(neng)(neng)化機(ji)，專為(wei)制(zhi)造(zao)業(ye)智能(neng)(neng)化和(he)(he)(he)(he)邊邊計算出來應用軟件(jian)而(er)設計方(fang)案。該軟件(jian)手機(ji)平臺(tai)支持系統(tong)(tong)新(xin)型(xing)的(de)Intel處置器(qi)，分(fen)為(wei)12和(he)(he)(he)(he)13代Core、Pentium和(he)(he)(he)(he)Celeron國(guo)產，給予(yu)快(kuai)速機(ji)械性能(neng)(neng)和(he)(he)(he)(he)增強使用。可(ke)(ke)以Intel? 12/13th Gen Core / Pentium/ Celeron Desktop CPU，哪些治理器(qi)具備有125W的(de)TDP和(he)(he)(he)(he)LGA1700封(feng)口，可(ke)(ke)出具精湛的(de)功(gong)(gong)效和(he)(he)(he)(he)能(neng)(neng)耗等(deng)級(ji)。主(zhu)要包括Intel? Q670IC芯片組(zu)，為(wei)系統(tong)(tong)提拱保持穩(wen)定的(de)硬件(jian)配(pei)置公司和(he)(he)(he)(he)極為(wei)豐富(fu)的(de)尋址模塊。2個Intel線上插(cha)孔（11GbE & 12.5GbE），為(wei)了(le)保證高(gao)(gao)(gao)速的(de)安全穩(wen)定的(de)電腦網絡(luo)連到，提供大參數(shu)傳遞和(he)(he)(he)(he)實(shi)(shi)時(shi)路況(kuang)網絡(luo)通信的(de)實(shi)(shi)際(ji)需(xu)求。擁(yong)有3路現示模擬(ni)輸出，是指HDMI、DP++和(he)(he)(he)(he)里面(mian)的(de)LVDS。極限使用4K@60Hz識別率，夠(gou)滿足高(gao)(gao)(gao)畫面(mian)的(de)清晰度度界面(mian)顯示市(shi)場需(xu)求。打造(zao)多(duo)種多(duo)樣的(de)USB、串(chuan)口拓展插(cha)口和(he)(he)(he)(he)PCIe、mini PCIe、M.2擴容插(cha)槽(cao)，可(ke)(ke)選擇實(shi)(shi)際(ji)的(de)軟件(jian)市(shi)場訴(su)求實(shi)(shi)施來樣加工(gong)調試(shi)，滿足需(xu)要繁多(duo)復雜性的(de)工(gong)業(ye)企(qi)業(ye)電腦深圳自動(dong)化市(shi)場訴(su)求。智能(neng)(neng)化電風扇主(zhu)動(dong)的(de)蒸發器(qi)設汁，保證 體統(tong)(tong)在(zai)高(gao)(gao)(gao)過載下的(de)穩(wen)定性高(gao)(gao)(gao)行駛。
結合以(yi)上所訴，阿普奇(qi)E7S系列作(zuo)品H610app平臺嵌到式工業化(hua)(hua)(hua)自行化(hua)(hua)(hua)機(ji)仰(yang)仗(zhang)非常出(chu)色的(de)耐熱(re)性、豐富多樣(yang)的(de)音頻接口(kou)和高效率的(de)水冷設(she)計的(de)，為工業化(hua)(hua)(hua)自行化(hua)(hua)(hua)和邊部折算展(zhan)示了強有(you)力幫助，需(xu)求分析各個很復雜用途環境的(de)需(xu)求分析。
|
Model |
E7S |
E7DS |
|
|
CPU
|
CPU | Intel? 12/13th Generation Core / Pentium/ Celeron Desktop CPU | |
| TDP | 125W | ||
| Socket | LGA1700 | ||
| Chipset | H610 | ||
| BIOS | AMI 256 Mbit SPI | ||
|
Memory |
Socket | 2 * Non-ECC SO-DIMM Slot, Dual Channel DDR4 up to 3200MHz | |
| Max Capacity | 64GB, Single Max. 32GB | ||
|
Graphics |
Controller | Intel??UHD Graphics | |
|
Ethernet |
Controller | 1 * Intel i219-LM/V 1GbE LAN Chip (LAN1, 10/100/1000 Mbps) 1 * Intel i225-V/LM 2.5GbE LAN Chip (LAN2, 10/100/1000/2500 Mbps) |
|
|
Storage |
SATA | 1 * SATA3.0, quick release 2.5-inch hard drive bay (T ≤ 7mm) 1 * SATA3.0, Internal 2.5" hard disk bays (T≤9mm, Optional) |
|
| M.2 | 1 * M.2 Key-M (SATA3.0, 2280) | ||
|
Expansion Slots |
PCIe Slot | N/A | ①: 1 * PCIe x16 (x16)②: 2 * PCI
PS: ①、②One out of two, Expansion card length ≤ 185mm, TDP ≤ 130W |
| aDoor | 1 * aDoor Bus (Optional 4 * LAN/4 * POE/6 * COM/16 * GPIO expansion card) | ||
| Mini PCIe | 1 * Mini PCIe (PCIe3.0 x1 + USB 2.0, with 1*Nano SIM Card) | ||
|
Front I/O |
Ethernet | 2 * RJ45 | |
| USB | 2 * USB3.2 Gen2x1(Type-A, 10Gbps) 2 * USB3.2 Gen1x1(Type-A, 5Gbps) 2 * USB2.0 (Type-A) |
||
| Display | 1 * HDMI1.4b: max resolution up to 4096*2160 @ 30Hz 1 * DP1.4a: max resolution up to 4096*2160 @ 60Hz |
||
| Audio | 2 * 3.5mm Jack (Line-Out + MIC) | ||
| Serial | 2 * RS232/422/485 (COM1/2, DB9/M, Full Lanes, BIOS Switch) 2 * RS232 (COM3/4, DB9/M, Full Lanes) |
||
| Button | 1 * Power Button + Power LED 1 * AT/ATX Button 1 * OS Recover Button 1 * System Reset Button |
||
|
Rear I/O |
Antenna | 4 * Antenna hole | |
| SIM | 1* Nano SIM card slot (SIM1) | ||
|
Internal I/O |
USB | 6 * USB2.0 (wafer) | |
| LCD | 1 * LVDS (wafer): max resolution up to 1920*1200 @ 60Hz | ||
| Front Panel | 1 * FPanel (PWR + RST + LED, wafer) | ||
| Audio | 1 * Audio (Header) 1 * Speaker (2-W (per channel)/8-Ω Loads, wafer) |
||
| Serial | 2 * RS232 (COM5/6, wafer) | ||
| GPIO | 1 * 16 bits DIO (8xDI and 8xDO, wafer) | ||
| LPC | 1 * LPC (wafer) | ||
| SATA | 3 * SATA 7P Connector, up to 600MB/s | ||
| SATA Power | 3 * SATA Power (wafer) | ||
| FAN | 1 * CPU FAN (wafer) 2 * SYS FAN (KF2510-4A) |
||
|
Power Supply |
Type | DC, AT/ATX | |
| Power Input Voltage | 9~36VDC, P≤240W 18~60VDC, P≤400W |
||
| Connector | 1 * 4Pin Connector, P=5.00/5.08 | ||
| RTC Battery | CR2032 Coin Cell | ||
|
OS Support |
Windows | Windows 10/11 | |
| Linux | Linux | ||
|
Watchdog |
Output | System Reset | |
| Interval | Programmable 1 ~ 255 sec | ||
|
Mechanical |
Enclosure Material | Radiator: Aluminum alloy, Box: SGCC | |
| Dimensions | 268mm(L) * 194.2mm(W) * 67.7mm(H) | 268mm(L) * 194.2mm(W) * 118.5mm(H) | |
| Weight | Net: 4.5 kgTotal: 6 kg (Include packaging) | Net: 4.7kgTotal: 6.2 kg (Include packaging) | |
| Mounting | VESA, Wall mounted, Desktop | ||
|
Environment |
Heat Dissipation System | PWM Fan Cooling | |
| Operating Temperature | -20 ~ 60℃?(Industrial SSD) | ||
| Storage Temperature | -40 ~ 80℃?(Industrial SSD) | ||
| Relative Humidity | 10 to 90% RH (non-condensing) | ||
| Vibration During Operation | With SSD: IEC 60068-2-64 (3Grms@5~500Hz, random, 1hr/axis) | ||
| Shock During Operation | With SSD: IEC 60068-2-27 (30G, half sine, 11ms) | ||
| Certification | CE/FCC, RoHS | ||
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嵌入式工控機/BOX E7S系列H610平臺
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